New flying probe technology now at ETO DYNAMIC

Even faster and more flexible thanks to double-sided test technology!

Maximum speed thanks to double-sided test

High-precision measurements and high test coverage

Programming with Flying Bottom Probe

Economical – from prototype to series production

Test service – quality assurance with the latest flying probe technology

Since the first installation of TAKAYA flying probe technology in our electronics production in 2007, the development of these systems has been continuously adapted to the increasing complexity and packing density of electronic assemblies.
With the APT1600FD system of the new flying probe generation, we have significantly expanded our test capabilities and offer you a significantly higher test speed and test coverage.

Higher testing speed

Thanks to simultaneous, double-sided tests with 6+4 “flying” needles on the top and bottom of the PCB, we achieve a significant reduction in test and set-up times.
Signature analysis can further accelerate the tests.
In addition, automated board handling in magazine-to-magazine operation further shortens throughput times.

Increasing accuracy and test coverage

High-precision mechanics with 6 heads and 10 flying probes allow gentle contacting of the smallest contact points at 60 μm.
Access to highly complex structures – even where no test points are provided on the layout for space reasons or due to special circuit technology requirements.
Extensive DAC/ADC measuring equipment, 4-quadrant voltage supplies, signal generators, lasers and HD color cameras allow highly accurate and flexible test procedures for active and passive components, optical tests, current/voltage measurements and functional tests.

On-board programming directly via the needles of the flying probe system

Thanks to the double-sided concept, the programming interface of several test specimens in the panel can be contacted and programmed sequentially with a flying needle package on the underside.
Savings in additional handling steps – programming takes place after successful MDA and voltage testing as a downstream test step in a test instance.
Software changes and the programming of dynamic parameters can be quickly and flexibly integrated into the test during the development phase of an assembly.

Reduction of testing costs

Even with small production batches, a large number of variants and complex structures on the PCB, enormous time savings are achieved thanks to tests that can be carried out quickly with a high test depth.
Automated test program generation from the CAD data enables cost-effective testing from the very first assembly.
We use our software solution for effective data preparation and simple test generation.
> MERLIN PRO
The test scope can be selected to suit your assemblies (MDA test; current/voltage test, function test, boundary scan, on-board programming).

Flying Probe test service

We can test your assembled PCBs for you – our range of services:

Test program creation
Flying probe test from prototype to series production
Function tests and on-board programming
Creation of test coverage reports
Provision of test results in the ETO cloud